Senior Packaging Engineer | Semiconductor & Photonics | Scotland

Written By Daniel MacNeill

Exclusive Search Assignment

Irvine Stewart is supporting a specialist technology business on an exclusive basis with a business-critical appointment for a Senior Packaging Engineer. This is a hands-on engineering role combining semiconductor packaging, process development and new product introduction, offering the opportunity to influence both current programmes and future technology capabilities.

Scotland | Semiconductor & Photonics Packaging | Relocation Support Available

For a confidential discussion, please contact:

dan@irvinestewart.com

+44 (0)77 6666 2266

Register Interest


The Opportunity

This is a strategically important hire and will play a significant role in the development, packaging and manufacture of advanced semiconductor and photonics products. The successful candidate will help shape future technology capabilities while driving process development, new product introduction and manufacturing excellence across a range of highly innovative programmes.

This position offers the opportunity to take ownership of a broad range of engineering activities, including:

  • Semiconductor and photonics package design

  • Assembly and packaging process development

  • New Product Introduction (NPI)

  • Equipment programming and operation

  • Process optimisation and continuous improvement

  • Design for manufacture (DfM)

  • Customer-driven engineering projects

  • Yield improvement and process robustness initiatives

  • Cross-functional collaboration with engineering and manufacturing teams

The role would particularly suit an engineer who enjoys combining technical problem-solving with practical implementation and hands-on process development.

What We're Looking For

The ideal candidate will bring a strong understanding of advanced packaging and semiconductor assembly technologies, alongside practical manufacturing experience.

Key experience is likely to include:

  • Wafer saw processes

  • Epoxy and solder die attach

  • Wire bonding

  • Semiconductor packaging and assembly

  • Process development and process optimisation

  • Mechanical design using SolidWorks or equivalent CAD software

  • Project planning and project management

  • FMEA and DOE methodologies

  • New Product Introduction activities

Experience in the following areas would be advantageous:

  • Fibre optic alignment

  • Package sealing technologies

  • Encapsulation processes

  • Surface mount assembly

  • Thermal or stress modelling

  • Yield improvement and statistical process control (SPC)

Ideal Background

We're particularly interested in candidates from:

  • Semiconductor manufacturing

  • Photonics manufacturing

  • Optoelectronics

  • Advanced electronic packaging

  • Microelectronics assembly environments

Successful applicants are likely to possess a broad understanding of both package design and manufacturing execution.

Importantly, candidates with exclusively package design experience and limited exposure to assembly operations or process development are unlikely to be the right fit. This position requires an engineer who understands how design decisions translate into real-world manufacturing performance and who is comfortable working directly with equipment, processes and production challenges.

Personal Attributes

The successful candidate will be:

  • Hands-on and technically curious

  • Constructive and collaborative in their approach

  • Comfortable working within a close-knit engineering team

  • Able to balance detailed technical work with broader project objectives

  • Capable of communicating effectively with internal stakeholders and customers

  • Motivated by solving complex manufacturing and packaging challenges

Qualifications & Experience

  • Degree qualified in Engineering, Physics, Materials Science or a related discipline

  • Alternative qualifications will be considered where supported by significant relevant industry experience

  • Typically 5+ years' experience within semiconductor, photonics or advanced manufacturing environments

Package

A competitive salary and benefits package is available, including:

  • Competitive salary with regular reviews

  • Relocation assistance where required

  • Private medical insurance

  • Life assurance

  • Matched pension contributions

  • Flexible working arrangements

  • Enhanced family leave benefits

  • Additional employee benefits and wellbeing initiatives

For a confidential discussion regarding this business-critical appointment, please contact Dan MacNeill at Irvine Stewart Talent Partners.

 

Daniel MacNeill