We're seeking a Senior Packaging Engineer to join an innovative technology business operating at the intersection of semiconductor and photonics. This business-critical role offers the opportunity to influence the development, packaging and manufacture of advanced technology products while helping shape future manufacturing and engineering capabilities.
Scotland | Semiconductor & Photonics Packaging | Relocation Support Available
For a confidential discussion, please contact:
+44 (0)77 6666 2266
The Opportunity
This is a strategically important hire that will play a significant role in the development, packaging and manufacture of advanced semiconductor and photonics technologies. The successful candidate will help shape future engineering and manufacturing capabilities while supporting process development, new product introduction and continuous improvement activities across a range of innovative programmes.
This position offers the opportunity to take ownership of a broad range of engineering activities, including:
Semiconductor and photonics packaging technologies
Assembly and manufacturing process development
New Product Introduction (NPI)
Equipment operation and process ownership
Process optimisation and continuous improvement
Design for Manufacture (DfM)
Customer-facing engineering projects
Yield improvement and product quality initiatives
Collaboration with multidisciplinary engineering and manufacturing teams
The role would particularly suit an engineer who enjoys combining technical problem-solving with practical implementation and hands-on manufacturing challenges.
What We’re Looking For
The ideal candidate will bring experience within a high-technology manufacturing environment, alongside a strong understanding of advanced packaging, assembly or process engineering.
Key experience is likely to include:
Semiconductor, photonics or advanced electronic packaging
Manufacturing process development and optimisation
New Product Introduction (NPI)
Equipment operation, programming or process ownership
Design for Manufacture (DfM)
Mechanical design using CAD software
Project planning and cross-functional collaboration
Structured problem-solving methodologies such as FMEA and DOE
Yield improvement and continuous improvement initiatives
Experience in one or more of the following areas would be beneficial:
Semiconductor assembly processes
Die attach and interconnect technologies
Wire bonding or related packaging techniques
Optical packaging and alignment processes
Encapsulation and package sealing technologies
Surface mount assembly
Thermal or stress modelling
Statistical process control (SPC)
Ideal Background
We're particularly interested in candidates from:
Semiconductor manufacturing
Photonics manufacturing
Optoelectronics
Advanced electronic packaging
Microelectronics assembly
Other highly regulated or precision manufacturing environments
Successful candidates are likely to combine an understanding of product design with practical manufacturing experience and a strong appreciation of how engineering decisions translate into robust production outcomes.
This role will appeal to engineers who enjoy working close to products, processes and equipment, and who are motivated by solving complex technical and manufacturing challenges.
Personal Attributes
The successful candidate will be:
Hands-on, practical and technically curious
Constructive and collaborative in their approach
Comfortable working within a close-knit engineering team
Able to balance detailed technical work with broader project objectives
An effective communicator, capable of engaging with colleagues, customers and external stakeholders
Motivated by solving complex engineering, manufacturing and packaging challenges
Qualifications & Experience
Candidates are likely to possess:
A degree in Engineering, Physics, Materials Science or a related discipline
Alternatively, significant relevant industry experience supported by appropriate technical expertise
Experience within semiconductors, photonics, optoelectronics or other advanced manufacturing environments
Package
A competitive salary and benefits package is available, including:
Competitive salary with regular reviews
Relocation assistance where required
Private medical insurance
Life assurance
Matched pension contributions
Flexible working arrangements
Enhanced family leave benefits
Additional employee benefits and wellbeing initiatives
For a confidential discussion, please contact Dan MacNeill at Irvine Stewart Talent Partners.